Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo El diseño arqueado de la Redmi Note 14

Name: Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo El diseño arqueado de la Redmi Note 14
Brand: kurma303.com
SKU: 25855499697
Price: 7995.00 USD
Availability: InStock
Rating: 4.4266000000000005 (18 reviews)

SKU: 25855499697

4.4

kurma303.com

EUR7995.00 EUR8036.00 Court rate

Size & fit on this sheet — checkout stays in the sticky dock.

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Ships within 48 hours · Estimated delivery Nov 3 - Nov 8

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Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo El diseño arqueado de la Redmi Note 14 El diseño arqueado de la parte posterior es cómodo y estable que no amarillea Herramienta de reparación profesional: Diseñada para técnicos y talleres profesionales resistente al calor y a la deformación

Exchange/Return Notes

We offer a 30-day return/exchange service after receiving.
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Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo El diseño arqueado de la Redmi Note 14

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